F4BTMS450 4-Layer 1.4mm ENIG PCB for Aerospace and Radar Systems
1.Introduction
The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.
By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.
The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.
2.Key Features
Controlled Dielectric Constant: 4.5 ±0.09 at 10GHz
Low Loss Performance: Dissipation factor of 0.0015 at 10GHz, 0.0019 at 20GHz
Excellent Dimensional Stability: CTE x-axis 12 ppm/°C, y-axis 12 ppm/°C, z-axis 45 ppm/°C (-55°C to 288°C)
Thermal Stability: Low thermal coefficient of Dk at -58 ppm/°C (-55°C to 150°C)
Safety Certified: UL-94 V0
Effective Thermal Management: Thermal conductivity of 0.64 W/MK
Environmental Resistance: Low Moisture absorption of 0.08%
3.Benefits
Enhanced Signal Integrity: Reduced dielectric loss and conductor loss
Improved Reliability: Excellent dimensional stability and thermal characteristics
Wide Frequency Range: Increased usable frequency spectrum
Superior Thermal Performance: Enhanced thermal conductivity and stable temperature characteristics
Manufacturing Advantages: Excellent peel strength and processing compatibility
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BTMS450 |
| Layer Count | 4-layer |
| Board Dimensions | 20mm × 20mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.4mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (4-Layer Rigid Structure)
| Layer | Material | Thickness |
|---|---|---|
| Copper Layer 1 | Copper | 35 μm |
| Dielectric 1 | F4BTMS450 Core | 0.127 mm (5mil) |
| Copper Layer 2 | Copper | 35 μm |
| Dielectric 2 | Prepreg RO4450F | 0.102 mm (4mil) |
| Dielectric 3 | F4BTMS450 Core | 0.127 mm (5mil) |
| Copper Layer 3 | Copper | 35 μm |
| Dielectric 4 | Prepreg RO4450F | 0.102 mm (4mil) |
| Dielectric 5 | F4BTMS450 Core | 0.762 mm (30mil) |
| Copper Layer 4 | Copper | 35 μm |
6.PCB Statistics:
Components: 3
Total Pads: 14
Thru Hole Pads: 6
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 4
Nets: 10
7.Typical Applications
Aerospace equipment, space and cabin equipment
Microwave, RF circuits
Radar, military radar systems
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications, and more
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
